The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
Sep. 09, 2022
Microjet Technology Co., Ltd., Hsinchu, TW;
Hao-Jan Mou, Hsinchu, TW;
Ching-Sung Lin, Hsinchu, TW;
Chih-Kai Chen, Hsinchu, TW;
Yung-Lung Han, Hsinchu, TW;
Chi-Feng Huang, Hsinchu, TW;
Tsung-I Lin, Hsinchu, TW;
MICROJET TECHNOLOGY CO., LTD., Hsinchu, TW;
Abstract
A fluid pump module includes a heat dissipation board assembly, a fixing frame body, fluid pumps, a control board and a conveying pipe is provided. The fixing frame body is fixed at one side of the heat dissipation board assembly, so as to form two accommodating spaces between the heat dissipation board assembly and the fixing frame body. Two fluid pumps are respectively disposed in the two accommodating spaces. The control board is disposed at another side of the heat dissipation board assembly. The conveying pipe connects the two fluid pumps in series so as to form a series connection therebetween. The control board controls operations of the fluid pumps, and the heat dissipation board assembly dissipates heats produced by a module formed by the two fluid pumps.