The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Sep. 29, 2020
Applicant:

Dow Global Technologies Llc, Midland, MI (US);

Inventors:
Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/32 (2006.01); B32B 7/027 (2019.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B65D 75/00 (2006.01); C08L 23/06 (2006.01);
U.S. Cl.
CPC ...
B32B 27/32 (2013.01); B32B 7/027 (2019.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/36 (2013.01); B65D 75/008 (2013.01); C08L 23/06 (2013.01); B32B 2250/24 (2013.01); B32B 2270/00 (2013.01); B32B 2274/00 (2013.01); B32B 2307/516 (2013.01); B32B 2307/518 (2013.01); B32B 2307/546 (2013.01); B32B 2307/558 (2013.01); B32B 2307/72 (2013.01); B32B 2307/732 (2013.01); B32B 2439/46 (2013.01); C08L 2205/02 (2013.01);
Abstract

The present disclosure provides for a multilayer film having a sealant layer and a first layer, where the first layer is formed from a first polyolefin composition, and a laminate that includes the multilayer film. The first polyolefin composition of the first layer consists essentially of a high density polyethylene (HDPE) resin and a propylene-ethylene copolymer thermoplastic elastomer (TPE). In addition to the first layer of the first polyolefin composition and the sealant layer, the laminate also includes a substrate film and an adhesive layer comprising polyurethane in adhering contact with the substrate film and the first layer, where when the adhesive layer is formed from a solvent-free adhesive the adhesive layer has an elastic modulus of greater than 25 MPa, and when the adhesive layer is formed from a solvent-based adhesive the adhesive layer has an elastic modulus of greater than 0.30 MPa, the elastic modulus being measured for the polyurethane in accordance with ASTM D412.


Find Patent Forward Citations

Loading…