The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
May. 24, 2018
Toyobo Co., Ltd., Osaka, JP;
Masahiro Yamashita, Otsu, JP;
Tetsuo Okuyama, Otsu, JP;
Toshiyuki Tsuchiya, Otsu, JP;
Naoki Watanabe, Otsu, JP;
Kaya Tokuda, Otsu, JP;
Shota Hara, Otsu, JP;
TOYOBO CO., LTD., Osaka, JP;
Abstract
The invention provides a laminate including a polyimide film and an inorganic substrate, which has a number density of blisters including carbide particles therein of/mor less, an average height of blisters of 2 μm or less, a product of the number density of the blisters (blisters/m) and the average height of the blisters (μm) of 20 or less. The inventive laminate can be obtained by laminating the polyimide film and the inorganic substrate after sufficiently purifying and cleaning to remove foreign bodies made of inorganic substance therefrom, followed by heat treating the laminate at a temperature of 350-600° C. and then rapidly cooling it to carbonize and reduce the organic foreign bodies, and also to rapidly cool the gas contained in the blisters, which leads to reduced height of blisters.