The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Nov. 26, 2020
Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Takamichi Aoki, Ichihara, JP;

Tomomichi Kanda, Ichihara, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 3/00 (2006.01); B32B 3/30 (2006.01); B32B 15/085 (2006.01); B32B 27/20 (2006.01); C08G 75/0204 (2016.01); C08K 3/26 (2006.01); C08K 7/02 (2006.01); C08K 7/14 (2006.01); C08L 23/00 (2006.01); C08L 77/10 (2006.01); C08L 81/02 (2006.01); C08L 91/06 (2006.01); C08L 101/00 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); C23C 18/24 (2006.01); C23C 30/00 (2006.01); C25D 5/56 (2006.01); C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
B32B 15/08 (2013.01); B32B 3/00 (2013.01); B32B 3/30 (2013.01); B32B 15/085 (2013.01); B32B 27/20 (2013.01); C08G 75/0204 (2013.01); C08K 3/26 (2013.01); C08K 7/02 (2013.01); C08K 7/14 (2013.01); C08L 23/00 (2013.01); C08L 77/10 (2013.01); C08L 81/02 (2013.01); C08L 91/06 (2013.01); C08L 101/00 (2013.01); C23C 18/1641 (2013.01); C23C 18/1653 (2013.01); C23C 18/2066 (2013.01); C23C 18/24 (2013.01); C23C 30/00 (2013.01); C25D 5/56 (2013.01); B32B 2250/02 (2013.01); B32B 2264/104 (2013.01); B32B 2264/204 (2020.08); B32B 2264/302 (2020.08); B32B 2264/303 (2020.08); B32B 2457/00 (2013.01); C08K 2003/265 (2013.01); C08K 2003/267 (2013.01); C08K 2201/005 (2013.01); C08L 2201/08 (2013.01); C08L 2203/20 (2013.01); C08L 2203/30 (2013.01); C08L 2205/035 (2013.01); C08L 2207/04 (2013.01); C25D 3/38 (2013.01); Y10T 428/12007 (2015.01); Y10T 428/12451 (2015.01); Y10T 428/12472 (2015.01); Y10T 428/12556 (2015.01); Y10T 428/12562 (2015.01); Y10T 428/12569 (2015.01); Y10T 428/12701 (2015.01); Y10T 428/12736 (2015.01); Y10T 428/12861 (2015.01); Y10T 428/12868 (2015.01); Y10T 428/12875 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12889 (2015.01); Y10T 428/12896 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12937 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/12951 (2015.01);
Abstract

Provided is a production method for a layered product in which a metal film can be formed on the surface of a polyarylene sulfide (PAS) molded article with a high adhesive force by a simple step. Further, provided are: a polyarylene sulfide resin composition and a molded article that can be used in the layered product in which a metal film can be formed on the surface of the PAS molded article with a high adhesive force by a simpler step; and production methods therefor. More specifically, provided are: a polyarylene sulfide resin composition obtained by blending a polyarylene sulfide resin, a thermoplastic elastomer and/or a hydrolyzable thermoplastic resin, a carbonate, and a polyolefin-based wax; a molded article which is obtained by melt-molding the polyarylene sulfide resin composition and in which the surface is roughened; a layered product having a metal plating layer; and production methods therefor.


Find Patent Forward Citations

Aoki, Takamichi. (2024). Layered product (U.S. Patent No. 12115754). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12115754

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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