The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2024

Filed:

Apr. 26, 2023
Applicant:

Hewlett-packard Development Company, L.p., Spring, TX (US);

Inventors:

Wei Huang, Palo Alto, CA (US);

Gary J. Dispoto, Palo Alto, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/40 (2017.01); B29C 64/165 (2017.01); B29C 64/393 (2017.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01);
U.S. Cl.
CPC ...
B29C 64/40 (2017.08); B29C 64/165 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

According to examples, a three-dimensional (3D) fabrication system may include a controller that may control an agent delivery system to deposit a fusing agent onto a fusing area of a layer of particles of build material. The controller may also control the agent delivery system to deposit an energy absorbing agent onto an unfused thermal support area of the layer of particles, the unfused thermal support area being located adjacent to the fusing area. The controller may further control an energy supply system to supply energy, in which supply of the energy is to cause the particles on which the fusing agent has been deposited to melt and a temperature of the particles in the unfused thermal support area to be raised to a level that is below a melting point temperature of the particles.


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