The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
Apr. 13, 2023
Applicant:
Kyoraku Co., Ltd., Kyoto, JP;
Inventors:
Akihiko Watanabe, Yamato, JP;
Masaaki Onodera, Yamato, JP;
Assignee:
Kyoraku Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60H 1/00 (2006.01); B29B 11/10 (2006.01); B29C 49/00 (2006.01); B29C 49/04 (2006.01); B29L 23/00 (2006.01); B29L 31/30 (2006.01); B29C 49/02 (2006.01); B29C 49/60 (2006.01); B29K 23/00 (2006.01); B29K 105/04 (2006.01);
U.S. Cl.
CPC ...
B29C 49/04 (2013.01); B29B 11/10 (2013.01); B29C 49/0005 (2013.01); B29C 49/06914 (2022.05); B29C 49/60 (2013.01); B29C 2049/6072 (2013.01); B29C 2049/609 (2013.01); B29K 2023/12 (2013.01); B29K 2105/04 (2013.01); B29K 2105/046 (2013.01); B29L 2023/00 (2013.01); B29L 2031/3032 (2013.01); B60H 1/00564 (2013.01);
Abstract
The present invention relates to molded foam having no hollow space caused in a plate-shaped portion. The molded foam comprises a tube body and a plate-shaped portion joined to the outer side of the tube body. The expansion ratio of the molded foam is lower than two, and a value of a thickness B/a thickness A as a relationship between the thickness A of the tube body at the periphery of a point joined to the plate-shaped portion and the thickness B of the plate-shaped portion is less than 2.82.