The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2024
Filed:
Nov. 07, 2022
Applicant:
Onrobot A/s, Odense, DK;
Inventors:
Mohammad Dadkhah Tehrani, Los Angeles, CA (US);
Nicholas Wettels, Los Angeles, CA (US);
Assignee:
OnRobot A/S, Odense SØ, DK;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 11/04 (2006.01); B25J 15/00 (2006.01); B81C 1/00 (2006.01); C09J 7/00 (2018.01); C09J 9/02 (2006.01); C09J 201/00 (2006.01); C08K 3/04 (2006.01);
U.S. Cl.
CPC ...
B25J 15/0085 (2013.01); B81C 1/00 (2013.01); B81C 1/00206 (2013.01); C09J 7/00 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 201/00 (2013.01); B81B 2207/056 (2013.01); C08K 3/04 (2013.01); C08K 3/041 (2017.05); C08K 2201/001 (2013.01); C09J 2301/31 (2020.08);
Abstract
Dry adhesive microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.