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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12114537 B1

PDFFull Text
Date of Patent:
Oct. 08, 2024

Filed:

Mar. 28, 2019

Display element

Applicant:

Sharp Kabushiki Kaisha, Sakai, JP;

Inventors:

Sentaro Kida, Sakai, JP;

Shigeru Aomori, Sakai, JP;

Tsuyoshi Kamada, Sakai, JP;

Yasushi Asaoka, Sakai, JP;

Jun Sakuma, Sakai, JP;

Assignee:

SHARP KABUSHIKI KAISHA, Osaka, JP;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 21/78 (2006.01); H10K 50/822 (2023.01); H10K 50/86 (2023.01); H10K 59/122 (2023.01); H10K 50/828 (2023.01); H10K 59/12 (2023.01); H10K 59/131 (2023.01); H10K 71/00 (2023.01); H10K 102/00 (2023.01);
U.S. Cl.
CPC ...
H10K 59/122 (2023.02); H10K 50/822 (2023.02); H10K 50/865 (2023.02); H10K 50/828 (2023.02); H10K 59/1201 (2023.02); H10K 59/131 (2023.02); H10K 71/00 (2023.02); H10K 2102/3026 (2023.02);
Abstract

Provided is a display element according to an aspect of the disclosure including a flattening film and, on the flattening film, a plurality of banks each having a linear shape, a plurality of active layers each having a linear shape and formed between adjacent banks, and an upper transparent electrode formed on each of the plurality of active layers. A cut line having a locally reduced height with reference to the flattening film is formed in each the plurality of banks, and the upper transparent electrode formed on one of the adjacent active layers and the upper transparent electrode formed on the other of the adjacent active layers are electrically connected via a conductive electrode formed in the cut line.

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