The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
May. 13, 2022
Sandisk Technologies, Inc., Milpitas, CA (US);
Virgil Zhu, Shanghai, CN;
Vincent Jiang, Shanghai, CN;
Paul Qu, Shanghai, CN;
Shixing Zhu, Shanghai, CN;
Yuanheng Zhang, Shanghai, CN;
Enoch He, Shanghai, CN;
Yonglong Liu, Shanghai, CN;
Lian Chen, Shanghai, CN;
Guangqiang Li, Shanghai, CN;
Jingyun Chen, Shanghai, CN;
SANDISK TECHNOLOGIES, INC., Milpitas, CA (US);
Abstract
A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.