The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Apr. 05, 2022
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

William Andrew Smith, Round Rock, TX (US);

Mallikarjun Vasa, Secunderabad, IN;

Bhyrav M. Mutnury, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); H05K 1/115 (2013.01); H05K 3/42 (2013.01); H05K 2201/09518 (2013.01); H05K 2201/09545 (2013.01);
Abstract

An information handling system includes a printed circuit board, a surface mount connector including first and second surface mount connector portions, first and second different pairs, and a ground plane. The first and second surface mount connector portions are mounted on the printed circuit board. The first differential pair is located on the first surface mount connector portion, and the second differential pair is located on the second surface mount connector portion. The ground plane is located in between the first and second surface mount connector portions within the printed circuit board. The first ground via is in physical communication with the ground plane and a first ground pad on a surface of the printed circuit board. The second ground via is in physical communication with the ground plane and a second ground pad on the surface of the printed circuit board.


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