The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Jun. 29, 2022
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Yongyao Li, Shenzhen, CN;

Shibin Xu, Dongguan, CN;

Wei Kang, Dongguan, CN;

Feng Wang, Shenzhen, CN;

Xue Feng, Shenzhen, CN;

Jiang Zhu, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0215 (2013.01); H05K 3/3436 (2013.01);
Abstract

This application provides an electronic module and an electronic device. The electronic module includes a first component, a second component, and a plurality of terminals. The first component includes a package substrate and a chip mounted on the package substrate. The second component includes a circuit board and a mount base mounted on the circuit board. Each terminal includes a body part, and a first bent part and a solder ball that are respectively connected to two opposite ends of the body part. In each terminal, the body part passes through and is fastened to the mount base, the first bent part presses against a corresponding first solder pad on the package substrate, and the solder ball is connected to a corresponding second solder pad on the circuit board.


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