The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

May. 25, 2022
Applicant:

Shenzhen Shokz Co., Ltd., Guangdong, CN;

Inventors:

Wenbing Zhou, Shenzhen, CN;

Yongshuai Yuan, Shenzhen, CN;

Wenjun Deng, Shenzhen, CN;

Xin Qi, Shenzhen, CN;

Fengyun Liao, Shenzhen, CN;

Assignee:

SHENZHEN SHOKZ CO., LTD., Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/46 (2006.01); H04R 1/08 (2006.01); H04R 1/28 (2006.01);
U.S. Cl.
CPC ...
H04R 1/46 (2013.01); H04R 1/083 (2013.01); H04R 1/2876 (2013.01); H04R 2460/13 (2013.01);
Abstract

A bone conduction microphone is provided. The bone conduction microphone may include a laminated structure formed by a vibration unit and an acoustic transducer unit. The bone conduction microphone may include a base structure configured to carry the laminated structure. At least one side of the laminated structure may be physically connected to the base structure. The base structure may vibrate based on an external vibration signal. The vibration unit may be deformed in response to the vibration of the base structure. The acoustic transducer unit may generate an electrical signal based on the deformation of the vibration unit. The bone conduction microphone may include at least one damping structural layer. The at least one damping structural layer may be arranged on an upper surface, a lower surface, and/or an interior of the laminated structure, and the at least one damping layer may be connected to the base structure.


Find Patent Forward Citations

Loading…