The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
May. 06, 2021
Samsung Electronics Co., Ltd., Suwon-si, KR;
Sungmin Kim, Hwaseong-si, KR;
Juhun Park, Seoul, KR;
Deokhan Bae, Suwon-si, KR;
Myungyoon Um, Seoul, KR;
Yuri Lee, Yongin-si, KR;
Inyeal Lee, Yongin-si, KR;
Yoonyoung Jung, Suwon-si, KR;
Sooyeon Hong, Yongin-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor device includes a first active (e.g., PMOSFET) region and an adjacent second active (e.g., NMOSFET) region on a substrate, a device isolation layer on the substrate and defining a first active pattern on the first active region and a second active pattern on the second active region, a gate electrode crossing the first and second active patterns, a first source/drain pattern and a second source/drain pattern adjacent to a side of the gate electrode, an interlayer insulating layer on the gate electrode, a first active contact penetrating the interlayer insulating layer to connect the first source/drain pattern and a second active contact penetrating the interlayer insulating layer to connect the second source/drain pattern and a buffer layer provided in an upper region of the interlayer insulating layer and interposed between the first active contact and the second active contact, wherein the buffer layer includes a material having etch selectivity with respect to the interlayer insulating layer.