The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Mar. 02, 2023
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventors:
Jia-Yuan Chen, Miao-Li County, TW;
Tsung-Han Tsai, Miao-Li County, TW;
Kuan-Feng Lee, Miao-Li County, TW;
Yuan-Lin Wu, Miao-Li County, TW;
Assignee:
INNOLUX CORPORATION, Miao-Li County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/34 (2010.01); H01L 33/44 (2010.01); H01L 33/46 (2010.01); H01L 33/50 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01); H10K 50/844 (2023.01); H10K 50/85 (2023.01); H10K 50/854 (2023.01); H10K 50/856 (2023.01); H10K 50/86 (2023.01); H10K 59/122 (2023.01); H10K 59/127 (2023.01); H10K 59/173 (2023.01); H10K 59/38 (2023.01); H10K 71/00 (2023.01); H10K 59/12 (2023.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 33/005 (2013.01); H01L 33/22 (2013.01); H01L 33/44 (2013.01); H01L 33/46 (2013.01); H01L 33/507 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H10K 50/844 (2023.02); H10K 50/854 (2023.02); H10K 50/856 (2023.02); H10K 50/865 (2023.02); H10K 59/122 (2023.02); H10K 59/127 (2023.02); H10K 59/173 (2023.02); H10K 59/38 (2023.02); H10K 71/00 (2023.02); H01L 2933/0025 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01); H10K 59/1201 (2023.02);
Abstract
An electronic device includes a substrate, a first light-emitting unit, a first light conversion unit, and a first buffer layer. The first light-emitting unit is disposed on the substrate. The first light conversion unit is disposed on the first light-emitting unit. The first buffer layer is disposed between the first light conversion unit and the first light-emitting unit. The thickness of the first light conversion unit is greater than the thickness of the first light-emitting unit.