The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Sep. 11, 2020
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Keishi Watanabe, Kyoto, JP;

Junya Yamagami, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/08 (2006.01); H01L 29/861 (2006.01); H01L 29/866 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0814 (2013.01); H01L 29/861 (2013.01); H01L 29/866 (2013.01);
Abstract

The present disclosure provides a diode chip capable of attaining excellent electrical characteristics. The present disclosure provides a diode chip (), including: a semiconductor chip () having a first main surface (); a first pin junction portion () formed on a surface of the first main surface () with a first polarity direction; a first diode pair () (rectifier pair) including a first pn junction portion () separated from the first pin junction portion () and formed in the semiconductor chip () with the first polarity direction and a first reversed pin junction portion () connected to the first pn junction portion () in reversed direction and formed on the first main surface () with a second polarity direction; and a first junction separation trench () formed on the first main surface () in a manner of separating the first pin junction portion () and the first diode pair ().


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