The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Oct. 19, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Chulwoo Kim, Incheon, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package includes a package substrate, an interposer on the package substrate, semiconductor devices in individual mounting regions on a first surface of the interposer, respectively, first conductive connection members, and a molding member on the interposer. The interposer has first bonding pads in the individual mounting regions, respectively. The semiconductor devices each have chip pads electrically connected to the first bonding pads. The first conductive connection members are between the first bonding pads and the chip pads. The molding member covers the semiconductor devices and fills gaps between the first surface of the interposer and the semiconductor devices. At least one of the individual mounting regions includes a pad-free region with a cross shape and pad regions defined by the pad-free region, and the first bonding pads are in the pad regions.