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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12113029 B1

PDFFull Text
Date of Patent:
Oct. 08, 2024

Filed:

Apr. 05, 2019

Semiconductor device and manufacturing method thereof

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Tatsuto Nishihara, Tokyo, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Long Pham

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/295 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A first molded resin containing first insulating fillers having particle sizes smaller than the opening size of a wire mesh is formed inside the wire mesh to seal a semiconductor chip, bonding wires, and bond pads, and a second molded resin containing second insulating fillers having particle sizes larger than the opening size of the wire mesh is formed outside the wire mesh to seal the semiconductor ship, the bonding wires, and the bond pads via the first molded resin and the wire mesh. This allows for reducing warpage during solder mounting and for improving productivity.

Find Patent Forward Citations

Nishihara, Tatsuto. (2024). Semiconductor device and manufacturing method thereof (U.S. Patent No. 12113029). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12113029

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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