The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Sep. 24, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Hsueh-Chung Chen, Cohoes, NY (US);

Yann Mignot, Slingerlands, NY (US);

Su Chen Fan, Cohoes, NY (US);

Mary Claire Silvestre, Clifton Park, NY (US);

Chi-Chun Liu, Altamont, NY (US);

Junli Wang, Slingerlands, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/76807 (2013.01); H01L 21/76883 (2013.01); H01L 23/53228 (2013.01); H01L 23/53257 (2013.01);
Abstract

A device includes: a first dielectric material; a first metal line in the first dielectric material; a second dielectric material disposed on the first dielectric material and the first metal line; a second metal line in the second dielectric material; and a plurality of metal vias disposed on a same level and connecting the first metal line and the second metal line, wherein the plurality of metal vias comprise a first top via and a bottom via having different sidewall profile angles.


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