The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Jan. 25, 2024
Applicant:
Diodes Incorporated, Plano, TX (US);
Inventor:
Shiau-Shi Lin, New Taipei, TW;
Assignee:
Diodes Incorporated, Plano, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/49 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4839 (2013.01); H01L 23/49811 (2013.01); H01L 23/49861 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/92 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/49051 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01);
Abstract
A semiconductor chip package may include a lead frame having a first surface and a second surface opposite to each other. A groove may be provided on the first surface of the lead frame and filled with an adhesive. A semiconductor chip may be disposed over the first groove and affixed on the first surface of the lead frame through the adhesive in the first groove. A carrier may be disposed on the second surface of the lead frame. A method for manufacturing the semiconductor chip package is also provided.