The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Aug. 18, 2022
Huazhong University of Science and Technology, Wuhan, CN;
Shenzhen Union Semiconductor Co., Ltd, Shenzhen, CN;
Zhiqiang Wang, Wuhan, CN;
Yayong Yang, Wuhan, CN;
Yuxin Ge, Wuhan, CN;
Guoqing Xin, Wuhan, CN;
Xiaojie Shi, Shenzhen, CN;
Huazhong University of Science and Technology, Wuhan, CN;
Shenzhen Union Semiconductor Co., LTD, Shenzhen, CN;
Abstract
The present invention belongs to the technical field of simulation of power semiconductor modules, and discloses a multi-physics co-simulation method of a power semiconductor module. The multi-physics co-simulation method of the power semiconductor module comprises: adopting professional circuit simulation software PSpice supporting a spice model to be imported into a device, and by designing a specific collaborative analysis method and performing secondary development of a software data exchange interface, i.e. constructing a coupling interface of co-simulation, performing electricity-heat-force co-simulation of two types of software PSpice and COMSOL by adopting an indirect coupling manner. The simulation time is greatly shortened, and the simulation efficiency is improved.