The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Sep. 28, 2018
Applicant:

Vayo (Shanghai) Technology Co., Ltd., Shanghai, CN;

Inventors:

Shengjie Qian, Shanghai, CN;

Fengshou Liu, Shanghai, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 15/16 (2006.01); G06F 16/23 (2019.01); G06F 16/953 (2019.01); G06F 30/31 (2020.01); G06F 30/394 (2020.01); G06F 111/20 (2020.01);
U.S. Cl.
CPC ...
G06F 16/23 (2019.01); G06F 16/953 (2019.01); G06F 30/31 (2020.01); G06F 30/394 (2020.01); G06F 2111/20 (2020.01);
Abstract

An EDA pad package library updating/application method and system, a medium, and a terminal. The method includes: extracting a graphic data of a pad and setting information of a component based on the pad from an EDA wiring data; querying and downloading a graphic model of the component according to attribute information of the component; forming a simulated package pad by simulating and assembling the graphical model of the component and the graphical data of the pad according to setting information of the component based on the pad; storing the simulated package pad in a model database, updating an existed EDA pad package library by associating the simulated package pad to a predetermined keyword/words in the model database. A package pad created by others can be quickly obtained without a package pad library. The best pads that have been verified can be updated continuously and quickly.


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