The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
May. 18, 2021
Stensborg A/s, Roskilde, DK;
Leif Yde, Copenhagen, DK;
Jan Fagerbo Stensborg, Sjællands Odde, DK;
Stensborg A/S, Roskilde, DK;
Abstract
In an embodiment there is provided a method for simultaneous dual-sided direct imprinting of surface relief structures on a substrate, the method utilising an imprinting arrangement comprising first and second rotatable cylinders, each rotatable cylinder being arranged to carry at least one mould having a surface relief structure, at least one rotatable cylinder comprising a resilient layer located between a cylindrical outer surface of the respective rotatable cylinder and the respective mould, and the rotatable cylinders being movable with respect to one another and arranged to form an imprinting nip therebetween, the imprinting nip having an imprinting contact area, wherein the method comprises the steps of: a) providing to the imprinting nip a substrate comprising first and second sides each having a curable medium thereon; b) directly imprinting surface relief structures into the curable medium on both the first and second sides of the substrate by passing the substrate through the imprinting nip and engaging, in the imprinting contact area, a first mould on the first rotatable cylinder with the curable medium on the first side of the substrate and a second mould on the second rotatable cylinder with the curable medium on the second side of the substrate; and c) illuminating at least a part of the curable media on the first and second sides of the substrate with curing radiation to at least partially cure the curable media on the substrate.