The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Feb. 25, 2020
Resin molding material, method for producing same, and method for producing resin member or the like
Miyoshi Oil & Fat Co., Ltd., Tokyo, JP;
Kotaro Kaneko, Tokyo, JP;
Koji Kawai, Tokyo, JP;
MIYOSHI OIL & FAT CO., LTD., Tokyo, JP;
Abstract
Provided are a resin molding material, a method for producing same, and a method for producing resin member or the like, said resin molding material being a resin molding material which is capable of reducing a loss of ultraviolet absorber, resulting in less contamination in facilities, minimizing the impact of harmful lights by efficiently absorbing harmful lights in the wavelength region of 380 to 400 nm (to 420 nm), and suppressing the absorption of lights having a wavelength of not shorter than 400 nm (420 nm) which is a primary cause of early-stage yellowing to thereby produce a member having a superior appearance since the ultraviolet absorber is less prone to be sublimed during hot-melt compounding (first/second processing) that requires a high-temperature processing, or during other heat processing. The resin molding material is used in heat processing and comprises a resin and a 2-phenylbenzotriazole derivative that contains a thioether-containing group.