The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Jun. 28, 2021
Applicant:

Akron Polymer Systems, Inc., Akron, OH (US);

Inventors:

Limin Sun, Copley, OH (US);

Frank W. Harris, Boca Raton, FL (US);

Jiaokai Jing, Uniontown, OH (US);

Haci B. Erdem, Akron, OH (US);

John D. Harvey, Seville, OH (US);

Dong Zhang, Uniontown, OH (US);

Assignee:

Akron Polymer Systems, Inc., Akron, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); B29C 35/02 (2006.01); B29C 39/14 (2006.01); B29C 41/24 (2006.01); B32B 17/06 (2006.01); B32B 17/10 (2006.01); B32B 27/34 (2006.01); C08G 69/32 (2006.01); C09D 177/10 (2006.01); B29K 77/00 (2006.01); B29L 7/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B29C 35/02 (2013.01); B29C 39/14 (2013.01); B29C 41/24 (2013.01); B32B 17/06 (2013.01); B32B 17/10 (2013.01); B32B 27/34 (2013.01); C08G 69/32 (2013.01); C09D 177/10 (2013.01); B29K 2077/00 (2013.01); B29K 2077/10 (2013.01); B29K 2995/0026 (2013.01); B29L 2007/008 (2013.01); B29L 2031/3475 (2013.01); B32B 2457/206 (2013.01); C08J 2377/10 (2013.01); Y10T 428/24975 (2015.01); Y10T 428/265 (2015.01);
Abstract

The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300° C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.


Find Patent Forward Citations

Loading…