The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Jul. 20, 2022
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Naoyuki Kushihara, Annaka, JP;
Rina Sasahara, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08F 283/10 (2006.01); C09D 151/08 (2006.01); C09J 151/08 (2006.01);
U.S. Cl.
CPC ...
C08F 283/10 (2013.01); C09D 151/08 (2013.01); C09J 151/08 (2013.01);
Abstract
Provided is a heat-curable resin composition capable of being turned into a cured product having a low relative permittivity, a low dielectric tangent, an excellent adhesiveness and a high resistance. The heat-curable resin composition contains:
Kushihara, Naoyuki. (2024). Heat-curable resin composition (U.S. Patent No. 12110356). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12110356
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile