The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Jan. 18, 2021
Oike & Co., Ltd., Kyoto, JP;
Denka Company Limited, Tokyo, JP;
Teiko Sato, Kyoto, JP;
Kota Nagaoka, Gunma, JP;
OIKE & CO., LTD., Kyoto, JP;
Denka Company Limited, Tokyo, JP;
Abstract
Provided is a metallic decoration film, having a protective layer, an anchor layer, a metal deposition layer, and a bonding layer. The metal deposition layer comprises indium, the protective layer comprises a first mixed resin layer and a second mixed resin layer, the second mixed resin layer is provided on the anchor layer side, the first mixed resin layer comprises a vinylidene fluoride-based resin and an acrylic acid ester-based resin, the second mixed resin layer comprises a vinylidene fluoride-based resin and an acrylic acid ester-based resin, a solid content concentration ratio (% by mass) of the vinylidene fluoride-based resin to the acrylic acid ester-based resin in the first mixed resin layer is 75:25 to 60:40, and a solid content concentration ratio (% by mass) of the vinylidene fluoride-based resin to the acrylic acid ester-based resin in the second mixed resin layer is 15:85 to 60:40.