The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Jun. 06, 2023
Applicant:

Diamet Corporation, Niigata, JP;

Inventors:

Shinichi Takezoe, Niigata, JP;

Tsuneo Maruyama, Niigata, JP;

Hideo Sakai, Niigata, JP;

Assignee:

DIAMET CORPORATION, Niigata, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B22F 5/10 (2006.01); B22F 7/08 (2006.01); B29C 45/26 (2006.01); B29K 705/00 (2006.01); B29L 31/04 (2006.01); F16C 33/14 (2006.01);
U.S. Cl.
CPC ...
B29C 45/1459 (2013.01); B22F 5/10 (2013.01); B22F 7/08 (2013.01); B29C 45/14065 (2013.01); B29C 45/26 (2013.01); B29C 45/2616 (2013.01); F16C 33/145 (2013.01); B29K 2705/00 (2013.01); B29L 2031/04 (2013.01);
Abstract

By using a forming die having a fixed die and a movable die moving along a parting surface on the fixed die and by moving the movable die along the parting surface, to press and hold a sintered part between the movable die and the fixed die, to form a cavity around the sintered part except parts which abut on the fixed die and the movable die by the forming die, and to fill the cavity with melted material which becomes an exterior part, so that the sintered part and the exterior part are integrated by insert molding.


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