The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Sep. 24, 2020
Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Hiroyuki Yamazaki, Joetsu, JP;

Daiyu Okafuji, Joetsu, JP;

Masaki Takeuchi, Joetsu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/38 (2006.01); G03F 7/00 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
B29C 33/3842 (2013.01); G03F 7/0002 (2013.01); H01L 21/0271 (2013.01);
Abstract

An imprint mold-forming substrate is manufactured by providing a starting imprint mold-forming substrate () having a patterned portion () and a non-patterned portion (), providing a table () having a recess (), bonding the substrate () to the table () such that the patterned portion () is received in the recess () of the table to define a space region () between the patterned portion () and the table () such that the patterned portion is not in direct contact with the table, and performing contour machining on the substrate () secured to the table ().


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