The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 08, 2024

Filed:

Dec. 08, 2020
Applicant:

Archem Inc., Tokyo, JP;

Inventors:

Yukiko Yamaguchi, Tokyo, JP;

Yoshiyuki Takahashi, Tokyo, JP;

Taichi Itabashi, Tokyo, JP;

Assignee:

Archem Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A47C 27/14 (2006.01); B29C 44/14 (2006.01); B60N 2/90 (2018.01); B29K 75/00 (2006.01); B29K 623/00 (2006.01); B29K 625/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
A47C 27/14 (2013.01); B29C 44/14 (2013.01); B60N 2/90 (2018.02); B29K 2075/00 (2013.01); B29K 2623/0633 (2013.01); B29K 2625/06 (2013.01); B29L 2031/771 (2013.01);
Abstract

A seat pad with improved thermal comfort and improved vibration absorptivity and a seat pad manufacturing method for easily obtaining the seat pad are provided. In the seat pad (), when a surface portion () up to 10 mm from a surface () is cut out and the air permeability ARof the surface portion () is measured in compliance with JIS K 6400, the air permeability ARis more than 5 cc/cm/sec and 25 cc/cm/sec or less. The seat pad manufacturing method is a seat pad manufacturing method for obtaining the seat pad () by supplying a molding material into a molding die and performing foam molding. As the molding die, a molding die an inner surface of which is covered with polystyrene or polyethylene is used.


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