The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Nov. 03, 2020
Applicants:

Beijing Boe Technology Development Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Hongfei Cheng, Beijing, CN;

Xueguang Hao, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10K 59/131 (2023.01); G02F 1/1362 (2006.01); G02F 1/1368 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H10K 59/131 (2023.02); G02F 1/136204 (2013.01); G02F 1/136286 (2013.01); G02F 1/1368 (2013.01); H01L 27/0266 (2013.01); H01L 27/0288 (2013.01);
Abstract

Provided is an array substrate, including: a first conductive wire, a second conductive wire and a first electrostatic protection unit, wherein the first electrostatic protection unit comprises a first thin-film transistor and a first capacitor; wherein a gate of the first thin-film transistor is suspended and is connected to a first electrode of the first thin-film transistor via the first capacitor, the first electrode of the thin-film transistor is connected to the first conductive wire, and a second electrode of the first thin-film transistor is connected to the second conductive wire.


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