The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Jul. 27, 2022
Applicant:

Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);

Inventors:

Feng Zhou, Ann Arbor, MI (US);

Hiroshi Ukegawa, South Lyon, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20254 (2013.01); H01L 23/3735 (2013.01); H01L 23/473 (2013.01); H01L 23/5383 (2013.01); H01L 23/5389 (2013.01); H01L 25/072 (2013.01); H05K 1/185 (2013.01); H05K 7/20927 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10522 (2013.01);
Abstract

Power electronics assemblies having embedded power electronics devices are disclosed. In one embodiment, a power electronics assembly includes a circuit board assembly that includes a substrate that is electrically insulating and a power electronics device assembly embedded in the substrate. The power electronics device assembly includes an S-cell that includes an inner graphite layer, a metal layer encasing the inner graphite layer, and a first surface of the metal layer comprising a recess provided within the first surface. The power electronics device assembly further includes a power electronics device disposed within the recess of the first surface.


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