The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Sep. 03, 2020
Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Justin A. Kasemodel, McKinney, TX (US);

Justin E. Stroup, McKinney, TX (US);

Allen L. Kelly, McKinney, TX (US);

Amanda M. Couch, McKinney, TX (US);

Randy L. Smith, Dallas, TX (US);

Assignee:

Raytheon Company, Tewksbury, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); B23K 1/00 (2006.01); B23K 37/04 (2006.01); B23K 101/42 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 3/3494 (2013.01); B23K 1/0016 (2013.01); B23K 37/0426 (2013.01); B23K 2101/42 (2018.08); H05K 1/0206 (2013.01); H05K 1/113 (2013.01); H05K 3/3436 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/1121 (2013.01);
Abstract

An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.


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