The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Nov. 22, 2021
Murata Manufacturing Co., Ltd., Kyoto, JP;
Toshikazu Harada, Kariya, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A printed board includes a laminate in which insulating base members formed of the same material are laminated with conductor patterns. The printed board includes a bent part that is thinner than first and second substrate portions. A first main surface is located on an inner peripheral side and a second main surface is located on an outer peripheral side of the printed board. The first and second substrate portions each include an outermost insulating base member connected to an outermost insulating base member of the bent portion. The bent part includes a first conductor pattern closer to the first main surface and a second conductor pattern closer to the second main surface. A distance from the first conductor pattern to the first main surface is greater than a distance from the second conductor pattern to the second main surface. No interlayer connection conductors are located in the bent part.