The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Aug. 22, 2018
Applicant:
Shenzhen Raysees Ai Technology Co. Ltd., Shenzhen, CN;
Inventor:
Yang Wang, Dublin, CA (US);
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/02234 (2021.01); H01S 5/0225 (2021.01); H01S 5/023 (2021.01); H01S 5/0233 (2021.01); H01S 5/02335 (2021.01); H01S 5/0234 (2021.01); H01S 5/02345 (2021.01); H01S 5/0235 (2021.01); H01S 5/024 (2006.01); H01S 5/183 (2006.01); H01S 5/42 (2006.01); H01S 5/02253 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02469 (2013.01); H01S 5/02234 (2021.01); H01S 5/0225 (2021.01); H01S 5/023 (2021.01); H01S 5/0233 (2021.01); H01S 5/02335 (2021.01); H01S 5/0234 (2021.01); H01S 5/02345 (2021.01); H01S 5/0235 (2021.01); H01S 5/18305 (2013.01); H01S 5/423 (2013.01); H01S 5/02253 (2021.01); H01S 5/183 (2013.01);
Abstract
A Vertical Cavity Surface Emitting Laser (VCSEL) array package includes a VCSEL array chip bonded on a substrate, a support structure surrounding the VCSEL array chip, and an optical component mounted on the support structure. The support structure is molded directly on the substrate using a high thermal conductivity molding material. The support structure covers all side surfaces of the VCSEL array chip to facilitate heat transfer through the chip's sides. A transparent layer is deposited on the output surface of the VCSEL array chip, which prevents the support structure from blocking an output beam during molding.