The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Dec. 22, 2021
Applicant:

Microjet Technology Co., Ltd., Hsinchu, TW;

Inventors:

Hao-Jan Mou, Hsinchu, TW;

Ching-Sung Lin, Hsinchu, TW;

Yung-Lung Han, Hsinchu, TW;

Chi-Feng Huang, Hsinchu, TW;

Chin-Wen Hsieh, Hsinchu, TW;

Tsung-I Lin, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 25/50 (2013.01); H01L 2224/16153 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A system-in-package chip of printer driver system applicable in a printer includes a first chip, a second chip, and a third chip. The first chip, the second chip, and the third chip are arranged in a common package. The first chip and the second chip are arranged side-by-side on a carrier in the common package. The third chip is arranged on a top portion of the first chip in the common package. A wire carrier structure is formed on the top portion of the first chip before the third chip is disposed on the first chip.


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