The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Jan. 23, 2022
Applicant:
Fuji Electric Co., Ltd., Kanagawa, JP;
Inventor:
Sho Takano, Hino, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); B60L 50/00 (2019.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/24 (2006.01); H01L 23/538 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 21/4807 (2013.01); H01L 23/13 (2013.01); H01L 23/24 (2013.01); H01L 23/5385 (2013.01); H01L 25/072 (2013.01); B60L 50/00 (2019.02);
Abstract
Provided is a semiconductor device including: a laminated substrate in which a circuit layer, an insulating layer, and a metal layer are sequentially laminated. A slit is formed in the circuit layer. A recess recessed from one surface side facing the insulating layer toward the other surface side is formed in the metal layer. The recess of the metal layer has a relaxation portion at least partially overlapping the slit of the circuit layer in a planar view.