The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Sep. 27, 2020
Applicant:
Hkc Corporation Limited, Shenzhen, CN;
Inventor:
Peixin Lin, Shenzhen, CN;
Assignee:
HKC CORPORATION LIMITED, Shenzhen, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/52 (2020.01); G01R 31/26 (2020.01); G02F 1/1362 (2006.01); H01L 21/66 (2006.01); H01L 27/12 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); G01R 31/2607 (2013.01); G01R 31/52 (2020.01); G02F 1/136259 (2013.01); H01L 27/1259 (2013.01); G02F 1/133351 (2013.01); G02F 1/136254 (2021.01);
Abstract
Disclosed is a method for testing an array substrate, including: sequentially applying a curing drive signal to curing pad circuits according to an arrangement order of the curing pad circuits in a testing circuit board, the curing pad circuit is connected with at least two array substrates; and performing an array test on the array substrates in the curing pad circuit by the curing drive signal. The present application also discloses a device for testing an array substrate, and a computer readable storage medium.