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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12106995 B1

PDFFull Text
Date of Patent:
Oct. 01, 2024

Filed:

Mar. 26, 2020

Structure and method for transferring a micro semiconductor element by applying a separation force via a through hole

Applicant:

Xiamen Sanan Optoelectronics Technology Co., Ltd., Xiamen, CN;

Inventors:

Zheng Wu, Xiamen, CN;

Shao-Ying Ting, Xiamen, CN;

Chia-En Lee, Xiamen, CN;

Chen-Ke Hsu, Xiamen, CN;

Assignee:

QUANZHOU SAN'AN SEMICONDUCTOR TECHNOLOGY CO., LTD., Nanan, CN;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Khiem D Nguyen

Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 33/0093 (2020.05); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/83005 (2013.01);
Abstract

A method for transferring a micro semiconductor element includes the following steps. A substrate, a bonding layer disposed on the substrate, and a supporting member disposed on the bonding layer opposite to the substrate are provided. The supporting member is bonded to a micro semiconductor element for supporting the same. A through hole is provided to extend through the substrate, the bonding layer, and the supporting member so as to forma transfer structure. A separation force is applied via the through hole to separate the micro semiconductor element from the supporting member.

Find Patent Forward Citations

Wu, Zheng. (2024). Structure and method for transferring a micro semiconductor element by applying a separation force via a through hole (U.S. Patent No. 12106995). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12106995

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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