The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Sep. 09, 2021
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Satoshi Shigematsu, Nagaokakyo, JP;

Kenichi Ishizuka, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01G 4/005 (2006.01); H01G 4/40 (2006.01); H03H 7/01 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0006 (2013.01); H01F 27/292 (2013.01); H01G 4/005 (2013.01); H01G 4/40 (2013.01); H03H 7/0115 (2013.01); H03H 2001/0085 (2013.01);
Abstract

A circuit element includes a multilayer body, internal elements inside the multilayer body, and first outer electrodes and second outer electrodes on outer surfaces of the multilayer body, and the multilayer body includes laminated base material layers. The internal elements include coil conductors connected to the second outer electrodes, the coil conductors have a winding axis in the laminating direction of the base material layers, the first outer electrodes are in contact with a mounting surface of the multilayer body, the second outer electrodes are in contact with side edges of the multilayer body and separated from the mounting surface, and maximum widths of the second outer electrodes are smaller than maximum widths of the first outer electrodes.


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