The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Jan. 12, 2020
Coretronic Corporation, Hsin-Chu, TW;
Te-Ying Tsai, Hsin-Chu, TW;
Jia-Hong Dai, Hsin-Chu, TW;
Coretronic Corporation, Hsin-Chu, TW;
Abstract
A heat dissipation module adapted to dissipate the heat of a wavelength conversion device located inside a closed housing is provided. The heat dissipation module includes a first heat exchange element, a first cooling element, a second heat exchange element and a first heat conductive structure. The first heat exchange element is disposed inside the closed housing. The first cooling element has a cold side and a hot side opposite each other. The first cooling element is disposed inside the closed housing, and the cold side is located between the hot side and the first heat exchange element. The second heat exchange element is disposed outside the closed housing. One end of the first heat conductive structure is connected to the hot side of the first cooling element, and the other end of the first heat conductive structure is connected to the second heat exchange element.