The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Mar. 27, 2020
Sekisui Chemical Co., Ltd., Osaka, JP;
Tokuyama Sekisui Co., Ltd., Osaka, JP;
Kenichi Matsumura, Yamaguchi, JP;
Norikazu Mashino, Yamaguchi, JP;
Kento Murakami, Yamaguchi, JP;
Nami Nakajima, Osaka, JP;
Yasunari Kusaka, Osaka, JP;
Takehisa Sugaya, Yamaguchi, JP;
Masahiko Yamagata, Tokyo, JP;
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
TOKUYAMA SEKISUI CO., LTD., Osaka, JP;
Abstract
The present invention provides a chlorinated polyvinyl chloride resin that has resistance to thermal decomposition, provides excellent continuous productivity in molding, and imparts both processability and unevenness-preventing properties to a molded article. The present invention relates to a chlorinated polyvinyl chloride resin, containing three components including a Acomponent, a Bcomponent, and a Ccomponent, and having a percentage of the Ccomponent (Ccomponent/(Acomponent+Bcomponent+Ccomponent)) of less than 8.0%, the three components being identified by measuring the chlorinated polyvinyl chloride resin by a solid echo method using pulse NMR at 150° C. to give a free induction decay curve ofH spin-spin relaxation, and subjecting the free induction decay curve to waveform separation into three curves derived from the Acomponent, the Bcomponent, and the Ccomponent in order of shorter relaxation time using the least square method.