The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Apr. 02, 2019
Applicant:
Corning Incorporated, Corning, NY (US);
Inventors:
Hoon Kim, Horseheads, NY (US);
Jin Su Kim, Seoul, KR;
Assignee:
CORNING INCORPORATED, Corning, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 15/00 (2006.01); C03C 3/087 (2006.01); C03C 3/091 (2006.01); C03C 3/093 (2006.01); C03C 3/097 (2006.01); C03C 23/00 (2006.01);
U.S. Cl.
CPC ...
C03C 15/00 (2013.01); C03C 3/087 (2013.01); C03C 3/091 (2013.01); C03C 3/093 (2013.01); C03C 3/097 (2013.01); C03C 23/0005 (2013.01); C03C 23/002 (2013.01); C03C 23/0025 (2013.01);
Abstract
A method for forming a via in a glass article includes forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate including a glass cladding layer and a glass central core layer, where the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer, and where the one or more cavities extend through the glass central core layer terminating at the glass cladding layer, depositing a metallic material within the one or more cavities, and removing the glass cladding layer.