The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Aug. 06, 2019
Applicant:

Corning Incorporated, Corning, NY (US);

Inventors:

Bethany Jon Alderman, Bath, NY (US);

Patrick Joseph Cimo, Corning, NY (US);

Kuan-Ting Kuo, Chubei, TW;

Robert Lee Smith, III, Horseheads, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); B32B 17/06 (2006.01); C03B 23/037 (2006.01); C03C 4/18 (2006.01); C03C 10/00 (2006.01); C03C 15/00 (2006.01); C03C 21/00 (2006.01);
U.S. Cl.
CPC ...
C03B 23/037 (2013.01); C03C 4/18 (2013.01); C03C 10/0018 (2013.01); C03C 15/00 (2013.01); C03C 21/002 (2013.01); C03C 2204/00 (2013.01);
Abstract

A cover element for an electronic device that includes a glass element having a thickness from 20 μm to 125 μm, a first primary surface, a second primary surface, a compressive stress region extending from the first primary surface to a first depth, and a polymeric layer disposed over the first primary surface. Further, the glass element has a stress profile such that it has a bend strength of about 1850 MPa or more at a 10% failure probability, wherein the cover element is made by a multi-step method that employs a redraw thinning step and at least two chemical etching steps.


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