The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Jan. 27, 2020
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Tadatoshi Nakanishi, Osaka, JP;

Kakeru Hanabusa, Osaka, JP;

Motoi Kawamura, Osaka, JP;

Muneo Yamada, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/12 (2006.01); B32B 5/02 (2006.01); B32B 27/20 (2006.01); B32B 27/38 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/12 (2013.01); B32B 5/024 (2013.01); B32B 27/20 (2013.01); B32B 27/38 (2013.01); H05K 7/20963 (2013.01); H05K 9/0054 (2013.01); B32B 2307/202 (2013.01); B32B 2307/212 (2013.01); B32B 2307/30 (2013.01); B32B 2307/56 (2013.01); B32B 2457/20 (2013.01); H05K 9/009 (2013.01);
Abstract

A shock absorbing laminate includes: a shock absorbing layer having an adhesive property and a stress relieving property; a heat diffusion layer having a thermal diffusive property, and a shield layer having electromagnetic interference shielding characteristics. The shock absorbing layer, the heat diffusion layer, and the shield layer are stacked on one another. The shock absorbing laminate which has heat dissipation characteristics and electromagnetic interference shielding characteristics and which can be affixed to another member without using the adhesive layer can be provided.


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