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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12103246 B1

PDFFull Text
Date of Patent:
Oct. 01, 2024

Filed:

Nov. 15, 2017

Method of bonding substrates, microchip and method of manufacturing the same

Applicant:

Ushio Denki Kabushiki Kaisha, Tokyo, JP;

Inventors:

Motohiro Sakai, Tokyo, JP;

Shinji Suzuki, Tokyo, JP;

Fumitoshi Takemoto, Tokyo, JP;

Kenichi Hirose, Tokyo, JP;

Assignee:

USHIO DENKI KABUSHIKI KAISHA, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Christopher W Raimund

Int. Cl.
CPC ...
B29C 65/74 (2006.01); B29C 35/08 (2006.01); B29C 59/14 (2006.01); B29C 59/16 (2006.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01); B29C 65/14 (2006.01); B29L 11/00 (2006.01); B29L 31/00 (2006.01); B81C 3/00 (2006.01); C09J 5/02 (2006.01); H01L 21/18 (2006.01); H01L 21/20 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B29C 65/7415 (2013.01); B29C 59/14 (2013.01); B29C 59/16 (2013.01); B29C 65/1406 (2013.01); B29C 65/1432 (2013.01); B29C 66/028 (2013.01); B29C 66/1122 (2013.01); B29C 66/53461 (2013.01); B29C 66/54 (2013.01); B29C 66/83221 (2013.01); B81C 3/001 (2013.01); C09J 5/02 (2013.01); H01L 21/187 (2013.01); H01L 21/2007 (2013.01); H01L 21/67005 (2013.01); B29C 2035/0827 (2013.01); B29C 65/02 (2013.01); B29C 66/232 (2013.01); B29C 66/30223 (2013.01); B29C 66/534 (2013.01); B29C 66/71 (2013.01); B29C 66/712 (2013.01); B29C 66/73366 (2013.01); B29C 66/7465 (2013.01); B29C 66/919 (2013.01); B29C 66/92445 (2013.01); B29C 66/929 (2013.01); B29C 66/949 (2013.01); B29L 2011/00 (2013.01); B29L 2011/0016 (2013.01); B29L 2031/756 (2013.01); C09J 2400/143 (2013.01); C09J 2400/146 (2013.01); C09J 2400/163 (2013.01); C09J 2400/166 (2013.01);
Abstract

Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

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