The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Nov. 20, 2019
Branson Ultrasonics Corporation, Brookfield, CT (US);
Orihiro Engineering Co., Ltd., Tomioka, JP;
Toshiyuki Masunaga, Atsugi, JP;
Suguru Saiki, Atsugi, JP;
Masataka Tsuruta, Tomioka, JP;
Tsubasa Shintani, Tomioka, JP;
BRANSON ULTRASONICS CORPORATION, Brookfield, CT (US);
ORIHIRO ENGINEERING CO., LTD., Tomioka, JP;
Abstract
Provided is a bonding method capable of bonding with an inexpensive structure while avoiding an increase in the overall size of the device. The bonding method comprises: an arrangement step for locating a cylindrical body between two sheet-shaped members; a cylindrical body bonding step for applying an ultrasonic wave from the outer surface of a first sheet-shaped member through a horn part and applying heat from the outer surface of a second sheet-shaped member through an anvil part, in a state in which the cylindrical body is arranged between the two sheet-shaped members; and a shoulder part bonding step for directly bonding, through a pair of heating parts, the two sheet-shaped members to each other while the two sheet-shaped members are interposed between the pair of heating parts.