The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Jan. 23, 2020
Applicant:
Kyung Dong Mtec Co., Ltd., Asan-si, KR;
Inventors:
Heung Rak Sohn, Seoul, KR;
Bum Gyu Baek, Asan-si, KR;
Song Hee Yim, Pyeongtaek-si, KR;
Jun Tae Kim, Busan, KR;
Assignee:
KYUNG DONG MTEC CO., LTD., Asan-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); B23K 35/02 (2006.01); B23K 35/30 (2006.01); B23K 35/36 (2006.01); B23K 35/362 (2006.01); B23K 35/40 (2006.01); C22C 13/02 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B23K 35/0227 (2013.01); B23K 35/0244 (2013.01); B23K 35/264 (2013.01); B23K 35/3006 (2013.01); B23K 35/302 (2013.01); B23K 35/3601 (2013.01); B23K 35/362 (2013.01); B23K 35/40 (2013.01);
Abstract
The present disclosure relates to a lead-free solder alloy composition in which a nanosized ceramic powder additive is added to a lead-free solder alloy of Sn—Cu—Bi, Sn—Ag—Bi or Sn—Ag—Cu—Bi, and a method for preparing the same.