The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Dec. 22, 2021
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Akihiko Tsunoya, Okaya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/38 (2021.01); B22F 3/22 (2006.01); B22F 7/06 (2006.01); B22F 10/10 (2021.01); B22F 10/18 (2021.01); B22F 10/64 (2021.01); B22F 12/52 (2021.01); B33Y 10/00 (2015.01); B33Y 40/00 (2020.01);
U.S. Cl.
CPC ...
B22F 7/06 (2013.01); B22F 3/225 (2013.01); B22F 7/062 (2013.01); B22F 10/10 (2021.01); B22F 10/18 (2021.01); B22F 10/38 (2021.01); B22F 10/64 (2021.01); B22F 12/52 (2021.01); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12);
Abstract

A production method for producing a product by joining a first part containing an inorganic powder and a binder to a second part containing an inorganic powder and a binder is provided. The production method includes a first step of forming the first part by a three-dimensional shaping apparatus, a second step of forming the second part, a third step of assembling the first part and the second part, thereby obtaining an assembly, a fourth step of heating the assembly at a first temperature, and a fifth step of heating the assembly at a second temperature higher than the first temperature after the fourth step, wherein the first part has a first region that comes in contact with the second part and a second region that does not come in contact with the second part, and a melting point of the binder contained in the first region is lower than a melting point of the binder contained in the second region.


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