The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2024
Filed:
Oct. 11, 2019
Applicant:
Hewlett-packard Development Company, L.p., Spring, TX (US);
Inventors:
Aja Hartman, Palo Alto, CA (US);
John Samuel Dilip Jangam, Palo Alto, CA (US);
Lihua Zhao, Palo Alto, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 10/14 (2021.01); B22F 1/00 (2022.01); B22F 1/10 (2022.01); B22F 1/105 (2022.01); B22F 3/10 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01);
U.S. Cl.
CPC ...
B22F 10/14 (2021.01); B22F 1/09 (2022.01); B22F 1/105 (2022.01); B22F 3/1017 (2013.01); B22F 1/10 (2022.01); B22F 2201/013 (2013.01); B22F 2207/20 (2013.01); B22F 2999/00 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12);
Abstract
A kit for three-dimensional printing a metal object is described. The kit comprises a build material and a shaping composition. The build material comprises metallic particles. The shaping composition comprises a metallic mixture for forming an intermetallic compound with the metallic particles and/or that is exothermically reactive.