The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

Jan. 08, 2020
Applicant:

Nippon Shokubai Co., Ltd., Osaka, JP;

Inventors:

Takashi Sugimoto, Himeji, JP;

Hajime Gamma, Himeji, JP;

Hiromi Yunoki, Himeji, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01J 8/00 (2006.01); B01J 4/00 (2006.01); B01J 8/06 (2006.01); B05B 1/00 (2006.01); B05B 1/14 (2006.01); B05B 1/30 (2006.01);
U.S. Cl.
CPC ...
B01J 8/004 (2013.01); B01J 4/002 (2013.01); B01J 4/008 (2013.01); B01J 8/06 (2013.01); B05B 1/005 (2013.01); B05B 1/14 (2013.01); B05B 1/30 (2013.01); B01J 2208/00761 (2013.01);
Abstract

A nozzle includes: a flow path allowing gas to flow; tip opening portion(s) formed on a tip side of the flow path; a base end opening portion formed on a base end side of the flow path; and side hole(s) which is formed on the base end side from the tip opening portion and allows a part of the gas flowing through the flow path to be discharged toward the base end side. The tip opening portion(s) is formed in a direction of the flow path. The side hole(s) is formed along a circumferential direction of the flow path. When the gas is supplied from the base end opening portion, a ratio (Q1a/Q1b) of a flow rate (Q1a) of the gas discharged from the tip opening portion(s) and a flow rate (Q1b) of the gas discharged from the side hole(s) is 0.05 to 0.7.


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